Intel's Thin Mini-ITX platform gets stuffed inside a monitor

By Terrence O'Brien  posted Aug 8th 2012 8:31AM

You don't have to build custom motherboards and source specialty components to build a sleek all-in-one PC. At least not anymore, thanks to Intel's Thin Mini-ITX platform, which it debuted roughly a year ago at Computex. The main board is the same footprint as Mini-ITX (that's a 6.7-inch square), but it calls for a much shallower construction -- with horizontally stacked RAM and a shorter port cluster to keep the whole thing under an inch tall. To maintain its sleek physique, Intel pairs the desktop-class Core processor at the heart with a laptop-style heatsink and fan. It's a pretty interesting standard from Chipzilla, which Tech Report
ripped into, peeling back all it's layers like a silicon onion. The layout of all the essential jacks does pose a bit of an issue once the whole thing is set up, but its hard not to be impressed by the elegance and simplicity of the system. To see the whole thing torn down, then reassembled inside the chassis of an LCD panel, hit up the source link.
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Intel's SMARTi low-cost 3G systems show off their wireless prowess

Latest Intel Radio Frequency Solution Enables Lower-Cost 3G Designs for M2M and Emerging Markets

SANTA CLARA, Calif., July 26, 2012 –SMARTi™ UE2p, a radio frequency solution that integrates 3G power amplifiers into radio frequency circuits, has been announced by Intel Corporation. The new system-on-chip (SoC) solution enables a smaller footprint and reduces complexity for developers as well as the associated total cost of ownership.

"The SMARTi™ UE2p will simplify the product development and supply chain logistics with the reduction in component count and system complexity," said Stefan Wolff, vice president of the Intel Architecture Group and general manager of Multi-Com. "This will allow our customers to introduce lower-cost 3G handsets and support the transition of the machine-to-machine market segment toward 3G-based connected devices to help enable the 'Internet of things.'"

The SMARTi™ UE2p integrates Intel's 3G High Speed Packet Access (HSPA) radio frequency transceiver SMARTi™ UE2 and 3G power amplifiers on a single 65nm silicon die. The integration of power management and sensors allows direct connection to the device battery. The SMARTi™ UE2p supports multiple 3G dual band configurations for global operation with the Intel® XMM62xx HSPA slim modem family.

This solution is targeted at new mass market segments such as entry level 3G handsets and machine-to-machine modules. Samples are expected to be provided to select customers beginning in the fourth quarter of 2012. Intel will also continue its strategic collaborations with leading power amplifier vendors for smartphones and tablets.

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Posted in: Intels,lowcost,prowess,SMARTi,Systems,their,wireless